半導體及封裝

Universal 貼片機 / 異形零件插件機 / Hot Bar M/C

高精度置件機FuzionSC+HSWF(High Speed Wafer Feeder)

 

[簡介&摘要]
• ±10um精度@3σ,Cpk>1,< 3um重覆貼裝精度
•先進封裝產出最可高達16K,表面貼裝應用可高達30K cph
•基板尺寸可達813x508mm,另可配備更大板至813x625mm
•在同一平臺貼裝尺寸範圍寬廣的晶片及元件(0201-150mm2)
•可以對接各種送料器(晶圓送料器、盤式、卷帶式、管式及散裝式)
•可以在任何基板上貼裝(Wafer/基板/薄板/lead-frame/Glass/FPC)
•可搭配TAP Precisor以元件上部特徵對位後置件
•150至5千克的貼裝壓力(可選更低的貼裝壓力)

[適用產業&應用範圍]
•FC(倒裝晶片)
•Multi-Die(多種類晶片)
•Fan-out(扇出型封裝)
•WLP(晶圓級封裝)
•POP(堆疊封裝)
•Embedded(嵌入式應用)
•SiP(System in Package)
•CoWoS(Chip on Wafer on Substrate)
•2.5D/3D IC
•Automotive Headlamp(高精度車用智慧型頭燈)

[規格&型號]


FuzionSC1-11 & FuzionSC2-14

HSWF(High Speed Wafer Feeder)